What chips and electronic components are used in new energy vehicles? What do they control?

New energy vehicles (NEVs), including electric vehicles (EVs) and hybrid electric vehicles (HEVs), rely on a wide range of chips and electronic components to manage and control various systems. These components are critical for ensuring efficiency, safety, and performance. Below is a breakdown of the key chips and components used in NEVs and their functions:

1. Microcontroller Units (MCUs) and Microprocessors

• Examples: STM32, NXP S32K, Infineon Aurix, Texas Instruments TMS570.

• Function:

  • Control the powertrain, including the electric motor and transmission.

  • Manage battery management systems (BMS).

  • Handle vehicle control units (VCUs) for overall system coordination.

  • Process data from sensors and execute control algorithms.

2. Power Management ICs (PMICs)

• Examples: Infineon OPTIREG, Texas Instruments LM5170.

• Function:

  • Regulate and distribute power to various subsystems.

  • Manage voltage levels for sensors, actuators, and control units.

  • Optimize energy efficiency and reduce power losses.

3. Battery Management System (BMS) Chips

• Examples: Analog Devices ADBMS1818, Texas Instruments BQ76PL455A.

• Function:

  • Monitor and balance individual cell voltages in the battery pack.

  • Ensure safe charging and discharging of the battery.

  • Provide thermal management to prevent overheating.

  • Estimate the state of charge (SOC) and state of health (SOH).

4. Motor Control Chips

• Examples: Infineon IMC300, STMicroelectronics STM32 FOC.

• Function:

  • Control the speed, torque, and direction of the electric motor.

  • Implement field-oriented control (FOC) for efficient motor operation.

  • Interface with sensors (e.g., encoders, Hall effect sensors) for precise control.

5. DC-DC Converters

• Examples: ON Semiconductor NCP1034, Maxim Integrated MAX20090.

• Function:

  • Convert high-voltage DC from the battery to lower voltages for auxiliary systems (e.g., 12V or 48V).

  • Enable efficient power transfer between different voltage domains.

6. Inverters

• Examples: Infineon HybridPACK, Mitsubishi Electric J1 Series.

• Function:

  • Convert DC power from the battery to AC power for the electric motor.

  • Use insulated gate bipolar transistors (IGBTs) or silicon carbide (SiC) MOSFETs for high-efficiency switching.

7. Sensors

• Examples:

  • Current Sensors: Allegro ACS712, LEM LAH 50-P.

  • Temperature Sensors: NTC thermistors, Texas Instruments TMP117.

  • Position Sensors: Hall effect sensors, encoders.

• Function:

  • Monitor current, voltage, temperature, and position for motor and battery systems.

  • Provide feedback for control algorithms.

8. Communication Chips

• Examples:

  • CAN Transceivers: NXP TJA1050, Texas Instruments TCAN332.

  • Ethernet PHY: Microchip LAN8742A.

  • Wireless Modules: ESP32, Quectel BG96 (for IoT connectivity).

• Function:

  • Enable communication between electronic control units (ECUs) via CAN bus, LIN bus, or Ethernet.

  • Support vehicle-to-everything (V2X) communication for connected vehicles.

9. Gate Drivers

• Examples: Infineon EiceDRIVER, Texas Instruments UCC27531.

• Function:

  • Drive the gates of power transistors (e.g., MOSFETs, IGBTs) in inverters and DC-DC converters.

  • Ensure fast and reliable switching of high-power devices.

10. Charging Control Chips

• Examples: STMicroelectronics STBC08, Texas Instruments UCC28740.

• Function:

  • Manage AC/DC charging processes.

  • Support fast charging protocols (e.g., CCS, CHAdeMO).

  • Ensure safe and efficient charging of the battery.

11. Display and HMI Controllers

• Examples: NXP i.MX, Renesas R-Car.

• Function:

  • Drive the infotainment system and dashboard displays.

  • Process touch inputs and provide user interfaces.

12. Safety and Security Chips

• Examples: Infineon OPTIGA, NXP A1006.

• Function:

  • Ensure functional safety (e.g., ISO 26262 compliance).

  • Provide secure communication and authentication (e.g., for over-the-air updates).

13. Passive Components

• Examples:

  • Capacitors: Ceramic, electrolytic, and film capacitors.

  • Inductors: Power inductors for filtering and energy storage.

  • Resistors: Current sensing and voltage division.

• Function:

  • Filter noise and stabilize power supplies.

  • Provide energy storage and current limiting.

14. Advanced Components

• Silicon Carbide (SiC) and Gallium Nitride (GaN) Devices:

  • Examples: Cree Wolfspeed SiC MOSFETs, GaN Systems GS66508B.

  • Function:

    • Enable higher efficiency and power density in inverters and converters.

    • Reduce heat dissipation and improve range.

What These Components Control

1. Powertrain:

   • Electric motor control, torque management, and regenerative braking.

2. Battery System:

   • Charging, discharging, and thermal management.

3. Vehicle Dynamics:

   • Stability control, traction control, and anti-lock braking systems (ABS).

4. Infotainment:

   • Navigation, entertainment, and connectivity.

5. Safety Systems:

   • Airbag control, collision detection, and driver assistance systems (ADAS).

6. Auxiliary Systems:

   • Lighting, climate control, and power windows.

Key Trends in NEV Electronics

1. Integration: Combining multiple functions into a single chip (e.g., system-on-chip for motor control).

2. High Voltage: Supporting higher voltage levels (e.g., 800V systems) for faster charging and improved efficiency.

3. Connectivity: Enabling V2X communication and over-the-air updates.

4. Sustainability: Using eco-friendly materials and improving energy efficiency.

By leveraging these chips and components, new energy vehicles achieve high performance, safety, and efficiency, paving the way for the future of transportation.