NXP USA Inc.
MCF5274LVM166J Microcontrollers
MCF5274LVM166J
4-MCF5274LVM166J
IC MCU 32BIT ROMLESS 196MAPBGA
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Tech Specifications
Mfr
NXP USA Inc.
Series
MCF527x
Package
Tray
Core Processor
Coldfire V2
Program Memory Type
ROMless
RAM Size
64K x 8
Number of I/O
61
Operating Temperature
0°C ~ 70°C (TA)
Mounting Type
Surface Mount
Package / Case
196-LBGA
Supplier Device Package
196-LBGA (15x15)
Base Product Number
MCF5274
Speed
166MHz
Core Size
32-Bit Single-Core
Connectivity
EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals
DMA, WDT
Voltage - Supply (Vcc/Vdd)
1.4V ~ 1.6V
Oscillator Type
External
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Obsolescence/ EOL
Multiple Devices 03/Oct/2012Multiple Devices 13/Nov/2012
PCN Design/Specification
MCF5275 Errata Update 01/Oct/2013
PCN Packaging
All Dev Label Update 15/Dec/2020
Errata
MCF5275 Errata
MCF5274LVM166J Documents
Download datasheets and manufacturer documentation for MCF5274LVM166J
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Delivery Methods
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