NXP USA Inc.
LPC1830FET100,551 Microcontrollers
LPC1830FET100,551
4-LPC1830FET100,551
IC MCU 32BIT ROMLESS 100TFBGA
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Tech Specifications
Mfr
NXP USA Inc.
Series
LPC18xx
Package
Tray
Core Processor
ARM® Cortex®-M3
Program Memory Type
ROMless
RAM Size
200K x 8
Number of I/O
49
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
100-TFBGA
Supplier Device Package
100-TFBGA (9x9)
Base Product Number
LPC1830
Speed
180MHz
Core Size
32-Bit Single-Core
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, WDT
Voltage - Supply (Vcc/Vdd)
2.2V ~ 3.6V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Product Training Modules
LPC1800 SeriesPWM and Timer Applications Featuring SCTimer/PWMSPI Flash Interface LPC Cortex-M Microcontrollers
Video File
MCUXpresso Software & Tools Announcement from Geoff Lees
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
LPC MicrocontrollersLPC1850 30 Cortex-M3 MCUTicket Vending Machine
PCN Design/Specification
Datasheet Update 18/Apr/2015LPC18X0,LPC43X0 IRC Update 22/Aug/2014
PCN Assembly/Origin
LPC18/LPC43 Site Add 24/Feb/2022
PCN Packaging
All Dev Label Update 15/Dec/2020
LPC1830FET100,551 Documents
Download datasheets and manufacturer documentation for LPC1830FET100,551
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