-
XC7A200T-2FBG676C Overview
The XC7A200T-2FBG676C is a high-capacity field-programmable gate array (FPGA) device that belongs to the Xilinx 7 series family and offers an extensive range of features and capabilities for demanding applications. With a whopping 200,000 logic cells and a broad selection of I/O options, this FPGA provides ample capacity and flexibility for complex designs.The "2FBG676C" in the part number indicates that it is a 2-speed grade device in a Fine-Pitch Ball Grid Array (FBGA) package with 676 pins. This package type ensures reliable integration into electronic systems while providing a compact footprint.
Designed for high-performance applications, the XC7A200T-2FBG676C FPGA supports advanced features such as embedded memory blocks, high-speed serial transceivers, and programmable interconnects.This FPGA is well-suited for applications such as high-performance computing, data centers, telecommunications, and image/video processing, where its large logic capacity and versatile features enable the implementation of complex designs with exceptional performance and efficiency.
XC7A200T-2FBG676C Features
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.
XC7A200T-2FBG676C Applications
Consumer Electronics
Aerospace & Defense
Telecommunication
Wireless Communications
Voice recognition
-
XC7A200T-2SBG484C Overview
XC7A200T-2SBG484C is a powerful field-programmable gate array (FPGA) device that offers an impressive array of features and capabilities for demanding applications. With 200,000 logic cells and a wide range of I/O options, this FPGA provides ample capacity and flexibility. The "2SBG484C" in the part number indicates that it is a 2-speed grade device in a Small Ball Grid Array (SBGA) package with 484 pins. This package type ensures a compact and reliable integration into electronic systems.
Designed for high-performance applications, the XC7A200T-2SBG484C FPGA supports advanced functionalities such as embedded memory blocks, high-speed serial transceivers, and programmable interconnects. This FPGA is well-suited for a variety of applications including aerospace, defense, telecommunications, and data processing, where its large logic capacity and versatile features enable the implementation of complex designs with high performance and efficiency.
XC7A200T-2SBG484C Features
Endpoint and Root Port designs
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
XC7A200T-2SBG484C Applications
Industrial Automation
Communications
Automotive
Consumer Electronics
Artificial Intelligence
-
XC7A35T-2FGG484I Overview
XC7A35T-2FGG484I is a field-programmable gate array (FPGA) from Xilinx, which is a programmable logic device used for digital circuitry. This FPGA has a maximum of 33,280 logic cells, which can be used to implement complex digital circuits. It also has a maximum of 210 input/output pins, which can be used to interface with other digital devices. The power requirements for this FPGA are 0.95V to 1.05V for the core voltage, and 1.8V to 3.3V for the auxiliary voltage. The operating temperature range for XC7A35T-2FGG484I is -40°C to +100°C, which makes it suitable for use in a variety of environments. This FPGA is commonly used in applications such as automotive, communications, and industrial automation. The "FGG" in the part number refers to the package type, which is a 484-ball fine-pitch ball grid array (FBGA). The "2" in the part number indicates that this FPGA is a second-generation device. Overall, XC7A35T-2FGG484I is a versatile FPGA that can be used in a wide range of applications that require moderate logic resources and I/O capabilities.
XC7A35T-2FGG484I Features
Endpoint and Root Port designs
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.
XC7A35T-2FGG484I Applications
Automotive
Consumer Electronics
Artificial Intelligence
5G Technology
Cloud Computing
Wireless Technology
Industrial Control
Internet of Things
-
XC7A35T-1FGG484I Overview
XC7A35T-1FGG484I is a field-programmable gate array (FPGA) from Xilinx, which is a programmable logic device used for digital circuitry. This FPGA has a maximum of 33,280 logic cells, which can be used to implement complex digital circuits. It also has a maximum of 210 input/output pins, which can be used to interface with other digital devices. The power requirements for this FPGA are 0.95V to 1.05V for the core voltage, and 1.8V to 3.3V for the auxiliary voltage. The operating temperature range for XC7A35T-1FGG484I is -40°C to +100°C, which makes it suitable for use in a variety of environments. This FPGA is commonly used in applications such as automotive, communications, and industrial automation. The "FGG" in the part number refers to the package type, which is a 484-ball fine-pitch ball grid array (FBGA). Overall, XC7A35T-1FGG484I is a versatile FPGA that can be used in a wide range of applications that require moderate logic resources and I/O capabilities.
XC7A35T-1FGG484I Features
Endpoint and Root Port designs
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.
XC7A35T-1FGG484I Applications
Automotive
Consumer Electronics
Artificial Intelligence
5G Technology
Cloud Computing
-
XC7S25-L1FTGB196I Overview
This device is included in the package 196-LBGA, CSPBGA. There are 100 I/Os available for faster data transfer. A basic building block consists of 23360 logic elements/cells. You can utilize this FPGA module with your development board by connecting it via the Surface Mount connector. It requires a voltage supply of 0.92V0.98V to function. During system operation, the operating temperature should be kept between -40°C and 100°C TJ. The tray contains a replica of this FPGA for the sake of saving space. This device contains 1658880 RAM bits, which is the total number of RAM bits available. The FPGA is made up of 1825 LABs/CLBs.
XC7S25-L1FTGB196I Features
Endpoint and Root Port designs
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.
XC7S25-L1FTGB196I Applications
Consumer Electronics
Aerospace & Defense
Telecommunication
Wireless Communications
Voice recognition
-
XC7K325T-1FBG900C Overview
A basic building block is made up of 326080 logic elements/cells. This FPGA module can be mounted on the development board using a Surface Mount connector. The device operates at a supply voltage of 0.97V1.03V. When operating the machine, it is critical to keep the temperature between 0°C and 85°C TJ. This FPGA model has been packed in Tray to conserve space. This device has a total RAM capacity of 16404480 bits. Its primary part number, XC7K325T, can be used to locate related parts. It is critical that the RAM si2MBe of this FPGA module approach 2MB for the application to operate properly. The design in this example makes use of 900 pins.
XC7K325T-1FBG900C Features
Endpoint and Root Port designs
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.
XC7K325T-1FBG900C Applications
Aerospace & Defense
Telecommunication
Wireless Communications
Voice recognition
Embedded Vision
-
XC7S6-2FTGB196C Overview
Four FPGA families make up the Xilinx® 7 series FPGAs, which cover the full spectrum of system needs, from low cost, small form factor, cost-sensitive, high volume applications to ultra-high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications.
XC7S6-2FTGB196C Features
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.
XC7S6-2FTGB196C Applications
Aerospace & Defense
Telecommunication
Wireless Communications
Voice recognition
Embedded Vision
Audio
-
-
-
XC7A200T-1FBG484C Overview
A total of 285 I/Os makes it possible to transport data more coherently. There are 215360 logic elements or cells that make up a fundamental building block. It is driven by a 1V electrical supply voltage. The FPGA module's Surface Mount-slot connector can be used to link it to the development board. A battery between 0.95 and 1.05 volts powers this gadget. A temperature between 0°C and 85°C TJ must be maintained at all times to guarantee safe and effective functioning. There are 285 outputs incorporated into a device like this. For the sake of reducing space, this FPGA model is packed in Tray. On FPGA chips, there are 484 terminations altogether.
XC7A200T-1FBG484C Features
Endpoint and Root Port designs
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.
XC7A200T-1FBG484C Applications
Internet of Things
Medical Equipment
Consumer Electronics
Aerospace & Defense
Telecommunication
Ampheo Electronics