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XC7K325T-1FF676I Overview
The XC7K325T-1FF676I is one of the models in the Xilinx Kintex-7 FPGA family. These integrated circuits can be programmed to perform various logic functions and are widely used in digital design and prototyping. The XC7K325T-1FF676I, in particular, has a capacity of 325,000 logic cells and is designed for high-performance applications such as wireless communication, video processing, and high-speed networking. These integrated circuits are extensively used in digital design and prototyping due to their programmability, which allows for rapid design iterations and testing.
XC7K325T-1FF676I Features
Various configuration options include support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.
XC7K325T-1FF676I Applications
Military Temperature
Medical ultrasounds
Software-defined radio
Video & Image Processing
Aircraft navigation
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XC7K325T-2FFG676I Overview
The XC7K325T-2FFG676I is a member of Xilinx's Kintex-7 family of field-programmable gate arrays (FPGAs). A basic construction block has 326080 logic components or cells. One volt serves as the power source for it. This type of FPGA component is a member of the Field Programmable Gate Arrays family. This FPGA module can be mounted to the development board via a Surface Mount connector. It requires a power supply between 0.97V and 1.03V to function. When running, the temperature should be maintained between -40°C and 100°C TJ. 400 outputs were added during this device's installation. This FPGA model has been housed in Tray to conserve space. It has 676 terminations overall. With this device, there are 16404480 RAM bits accessible.
XC7K325T-2FFG676I Features
Various configuration options include support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.
XC7K325T-2FFG676I Applications
Industrial Automation
Communications
Automotive
Consumer Electronics
Artificial Intelligence
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XC7K325T-1FF900C Overview
The XC7K325T-1FF900C is a model of FPGA from Xilinx's 7 series that is made to provide excellent performance and versatility across a range of applications. The 500 I/O ports on the device allow for more efficient data transport. 326080 logic elements/cells are needed to create a basic building block. You can attach this FPGA module to the development board using a Surface attach connector. The device operates within 0.97V and 1.03V of the supply voltage. A temperature between 0°C and 85°C TJ must be maintained at all times to guarantee safe and effective functioning. There are integrated 500 outputs in the device. Due to limitations in space, Tray now includes this FPGA type.
XC7K325T-1FF900C Features
Endpoint and Root Port designs
Various configuration options include support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.
XC7K325T-1FF900C Applications
Aerospace & Defense
Telecommunication
Wireless Communications
Voice recognition
Embedded Vision
Audio
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XC7K325T-L2FBG900E Overview
The XC7K325T-L2FBG900E is an advanced FPGA device from the Xilinx Kintex-7 family, renowned for its exceptional performance and versatile programmable logic solutions. With its powerful features and capabilities, the XC7K325T-L2FBG900E FPGA provides a reliable and efficient solution across various applications.
Boasting a substantial logic cell capacity of 325,000, the XC7K325T-L2FBG900E enables the implementation of complex digital designs, making it an excellent fit for applications that demand extensive computational capabilities. Operating at the L2 speed grade, this FPGA ensures efficient data throughput and reliable performance, making it well-suited for tasks requiring high-speed processing and real-time responsiveness. Packaged in the robust FBG900E package, the XC7K325T-L2FBG900E facilitates seamless integration into printed circuit boards (PCBs). The package design ensures secure and efficient connections, enhancing reliability within electronic systems.With its reprogrammable nature, the XC7K325T-L2FBG900E FPGA offers unparalleled flexibility, allowing users to adapt to evolving requirements or implement specific functionalities. Its versatility makes it an ideal choice for applications that necessitate customizable and adaptable solutions.
In conclusion, the XC7K325T-L2FBG900E FPGA excels as a powerful and versatile programmable logic device. Offering a significant logic cell capacity, high-speed performance, and flexibility, it is an attractive option for engineers and developers seeking advanced FPGA solutions across diverse application domains.
XC7K325T-L2FBG900E Features
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.
XC7K325T-L2FBG900E Applications
Consumer Electronics
Artificial Intelligence
5G Technology
Cloud Computing
Wireless Technology
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XC7K325T-1FFG900C Overview
The XC7K325T-1FFG900C is a specific part number representing a Xilinx FPGA (Field-Programmable Gate Array) device. It belongs to the Kintex-7 family and offers impressive capabilities, including 325,000 logic cells, 1,620 Kb of block RAM, and 36.7 Mb of UltraRAM. The device is housed in a 900-pin Fine-pitch Ball Grid Array (FBGA) package, which distinguishes it from other package types like XC7K325T-2FFG676C, XC7K325T-2FBG676I, and XC7K325T-L2FBG676E.
Designed to deliver high processing performance, the XC7K325T-1FFG900C is suitable for a broad range of applications such as wired communication, wireless infrastructure, aerospace and defense, and high-performance computing. Its advanced features and robust processing power make it an excellent choice for complex applications that demand both high-speed performance and low power consumption. However, it's important to note that due to differences in pinout configuration, the XC7K325T-1FFG900C is not interchangeable with other package variants.
XC7K325T-1FFG900C Features
Endpoint and Root Port designs
Various configuration options include support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.
XC7K325T-1FFG900C Applications
Consumer Electronics
Aerospace & Defense
Telecommunication
Wireless Communications
Voice recognition
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XC7K325T-1FB676I Overview
The XC7K325T-1FB676I is a type of Xilinx FPGA, which is a field-programmable gate array device. It is part of the Kintex-7 family and has 325,000 logic cells, 1,620 Kb of block RAM, and 36.7 Mb of UltraRAM. This device comes in a 676-pin Fine-pitch Ball Grid Array (FBGA) package and has a different speed grade compared to XC7K325T-2FFG676C and XC7K325T-L2FBG676E. The XC7K325T-1FB676I is designed to provide high processing performance for various applications, including wired communication, wireless infrastructure, aerospace and defense, and high-performance computing. Its advanced features and high processing power make it ideal for complex applications that require both high-speed performance and low power consumption.
XC7K325T-1FB676I Features
A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
Quickly deploy embedded processing with MicroBlaze™ processor.
Integrated block for PCI Express® (PCIe), for up to x8 Gen3
Endpoint and Root Port designs
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
XC7K325T-1FB676I Applications
Consumer Electronics
Artificial Intelligence
5G Technology
Cloud Computing
Wireless Technology
Industrial Control
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XC7K325T-2FBG676I Overview
XC7K325T-2FBG676I is a high-performance FPGA device manufactured by Xilinx, which belongs to the Kintex-7 family. It provides 325,000 logic cells, 1,620 Kb of block RAM, and 36.7 Mb of UltraRAM, making it suitable for various high-performance applications. The device is housed in a 676-pin Fine-pitch Ball Grid Array (FBGA) package, which ensures high reliability and durability. However, it has a different pinout configuration than XC7K325T-2FFG676C, which means that it cannot be used interchangeably with that device. The XC7K325T-2FBG676I is designed to offer high processing power, low power consumption, and advanced features, making it an ideal choice for applications such as wired communication, wireless infrastructure, aerospace and defense, and high-performance computing.
XC7K325T-2FBG676I Features
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.
XC7K325T-2FBG676I Applications
Wireless Technology
Industrial Control
Internet of Things
Medical Equipment
Consumer Electronics
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XC7K160T-2FFG676C Overview
XC7K160T-2FFG676C is a high-performance field-programmable gate array (FPGA) device manufactured by Xilinx. It belongs to the Xilinx Kintex-7 family and offers a powerful combination of features and capabilities for demanding applications. With 160,000 logic cells, this FPGA provides ample capacity for complex designs.
The "2FFG676C" in the part number indicates that it is a 2-speed grade device in a Fine-Pitch Ball Grid Array (FBGA) package with 676 pins. This package type ensures reliable integration into electronic systems while maintaining a compact form factor.
The XC7K160T-2FFG676C FPGA supports advanced functionalities such as embedded memory blocks, high-speed serial transceivers, and programmable interconnects.
This FPGA is well-suited for applications such as high-performance computing, telecommunications, aerospace, and image processing, providing a versatile platform for implementing complex designs with high performance and efficiency.
XC7K160T-2FFG676C Features
Integrated block for PCI Express® (PCIe), for up to x8 Gen3
Endpoint and Root Port designs
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.
XC7K160T-2FFG676C Applications
Telecommunication
Wireless Communications
Voice recognition
Embedded Vision
Audio
Enterprise networking
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XC7K160T-1FBG676C Overview
The XC7K160T-1FBG676C is a high-performance field-programmable gate array (FPGA) device manufactured by Xilinx. It belongs to the Xilinx Kintex-7 family and offers a powerful combination of features and capabilities for demanding applications. With 160,000 logic cells, this FPGA provides a substantial capacity for complex designs.The "1FBG676C" in the part number indicates that it is a 1-speed grade device in a Fine-Pitch Ball Grid Array (FBGA) package with 676 pins. This package type ensures reliable integration into electronic systems while providing a compact form factor.
The XC7K160T-1FBG676C FPGA supports advanced functionalities such as embedded memory blocks, high-speed serial transceivers, and programmable interconnects. This FPGA is well-suited for applications such as high-performance computing, telecommunications, aerospace, and image processing, offering a powerful and versatile platform for implementing complex designs with high performance and efficiency.
XC7K160T-1FBG676C Features
Endpoint and Root Port designs
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offer easy migration between family members in the same package. All packages are available in Pb-free and selected packages in the Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power.
XC7K160T-1FBG676C Applications
Wireless Communications
Voice recognition
Embedded Vision
Audio
Enterprise networking
Ampheo Electronics