XC7S6-2CSGA225C

Overview
Manufacturer: Xilinx (now part of AMD) 
Series: Spartan-7 
Part Number: XC7S6-xxxx Key 
Specifications Logic Cells: 6,000 CLB 
Flip-Flops: 7,800 Block 
RAM: 180 Kbits 
DSP Slices: 10 Maximum 
I/Os: 100 
Package Type: FGG (Fine-pitch Ball Grid Array) 
Package Size: 484 pins 
Temperature Grade: Commercial (-40to +100) 
Speed Grade: -1
 
Key Features 
Low Power Consumption: Designed for power-sensitive applications, making it ideal for battery-powered and energy-efficient systems. 
High Performance: Offers significant processing power with a large number of logic cells and DSP slices, suitable for complex computation and signal processing tasks. 
Flexible I/O Options: Supports a wide range of I/O standards, enabling easy integration with various peripherals and interfaces. 
Reliability: Built to operate reliably within the industrial temperature range, ensuring stable performance for consumer and industrial applications.
Typical Applications Consumer Electronics: Ideal for applications such as video processing, image processing, and audio applications. 
Automotive: Suitable for advanced driver assistance systems (ADAS) and infotainment systems. Industrial Automation: Useful in motor control, machine vision, and industrial networking. 
Communications: Can be used in wireless communication devices and networking equipment. 
Medical Devices: Appropriate for portable medical devices and diagnostic equipment. Benefits Cost-Effective: Provides a balance of cost and performance, making it a budget-friendly option for a wide range of applications. 
Scalability: Offers flexibility for designs requiring scalable performance and resource utilization. Design Resources: Supported by a rich ecosystem of design tools and resources, making development easier and faster.

XC7S6-2CSGA225C Documents

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