NXP USA Inc.
P87LPC762BN,112
Microcontrollers
P87LPC762BN,112
4-P87LPC762BN,112
IC MCU 8BIT 2KB OTP 20DIP
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P87LPC762BN,112 Description
Tech Specifications
Mfr
NXP USA Inc.
Series
LPC700
Package
Tube
Core Processor
8051
Program Memory Type
OTP
RAM Size
128 x 8
Number of I/O
18
Operating Temperature
0°C ~ 70°C (TA)
Mounting Type
Through Hole
Package / Case
20-DIP (0.300", 7.62mm)
Supplier Device Package
20-DIP
Base Product Number
P87LPC762
Speed
20MHz
Core Size
8-Bit
Connectivity
I²C, UART/USART
Peripherals
Brown-out Detect/Reset, LED, POR, WDT
Program Memory Size
2KB (2K x 8)
Voltage - Supply (Vcc/Vdd)
2.7V ~ 6V
Oscillator Type
Internal
Product Training Modules
Migrating from 8/16-Bit MCUs to 32-Bit ARMs
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Obsolescence/ EOL
EOL Product Assembly Site Transfer 13/Jun/2016MCU Dip Supply Situation 12/May/2015Multiple Devices 01/Jul/2014
PCN Assembly/Origin
Assembly Site Transfer 4/Jan/2016
PCN Packaging
All Dev Label Update 15/Dec/2020
P87LPC762BN,112 Documents
Download datasheets and manufacturer documentation for P87LPC762BN,112
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