NXP USA Inc.
LPC5502JBD64Y
Microcontrollers
LPC5502JBD64Y
4-LPC5502JBD64Y
HIGH EFFICIENT ARM CORTEX-M33-BA
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LPC5502JBD64Y Description
Tech Specifications
Mfr
NXP USA Inc.
Series
LPC550x
Package
Tape & Reel (TR)
Core Processor
ARM® Cortex®-M33
Program Memory Type
FLASH
RAM Size
48K x 8
Number of I/O
45
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
64-TQFP Exposed Pad
Supplier Device Package
64-HTQFP (10x10)
Speed
96MHz
Core Size
32-Bit
Connectivity
CANBus, Flexcomm, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Program Memory Size
64KB (64K x 8)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 9x16b SAR
Oscillator Type
External, Internal
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
PCN Design/Specification
LPC55S0x/LPC550x 27/Apr/2023
LPC5502JBD64Y Documents
Download datasheets and manufacturer documentation for LPC5502JBD64Y
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Shopping Guide
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Shipping Rate
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