NXP USA Inc.
MC9S12XEP100CVL
Microcontrollers
MC9S12XEP100CVL
4-MC9S12XEP100CVL
IC MCU 16BIT 1MB FLASH 208MAPBGA
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MC9S12XEP100CVL Description
Tech Specifications
Mfr
NXP USA Inc.
Series
HCS12X
Package
Tray
Core Processor
HCS12X
Program Memory Type
FLASH
RAM Size
64K x 8
Number of I/O
152
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
208-BGA
Supplier Device Package
208-BGA (17x17)
Base Product Number
MC9S12
Speed
50MHz
EEPROM Size
4K x 8
Core Size
16-Bit
Connectivity
CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Program Memory Size
1MB (1M x 8)
Voltage - Supply (Vcc/Vdd)
1.72V ~ 5.5V
Data Converters
A/D 32x12b
Oscillator Type
External
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Design/Specification
Copper Wire Conversion 26/Feb/2015
PCN Packaging
Mult Dev Pkg Seal 15/Dec/2020Tray Attributes 29/Sep/2021
MC9S12XEP100CVL Documents
Download datasheets and manufacturer documentation for MC9S12XEP100CVL
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