NXP USA Inc.
LPC55S66JBD64Y
Microcontrollers
LPC55S66JBD64Y
4-LPC55S66JBD64Y
HIGH EFFICIENCY ARM CORTEX -M33
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LPC55S66JBD64Y Description
Tech Specifications
Mfr
NXP USA Inc.
Series
LPC55S6x
Package
Tape & Reel (TR)
Core Processor
ARM® Cortex®-M33
Program Memory Type
FLASH
RAM Size
144K x 8
Number of I/O
36
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
64-TQFP Exposed Pad
Supplier Device Package
64-HTQFP (10x10)
Speed
150MHz
Core Size
32-Bit
Connectivity
Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Program Memory Size
256KB (256K x 8)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 10x16b SAR
Oscillator Type
Internal
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
LPC55S66JBD64Y Documents
Download datasheets and manufacturer documentation for LPC55S66JBD64Y
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