NXP USA Inc.
LPC5534JBD100E
Microcontrollers
LPC5534JBD100E
4-LPC5534JBD100E
IC MCU 32BIT 128KB FLSH 100HLQFP
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LPC5534JBD100E Description
Tech Specifications
Mfr
NXP USA Inc.
Package
Tray
Core Processor
ARM® Cortex®-M33
Program Memory Type
FLASH
RAM Size
96K x 8
Number of I/O
66
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
100-LQFP
Supplier Device Package
100-HLQFP (14x14)
Base Product Number
LPC5534
Speed
150MHz
Core Size
32-Bit Single-Core
Connectivity
CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART, USB2.0
Peripherals
DMA, PWM, WDT
Program Memory Size
128KB (128K x 8)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 23x16b; D/A 2x12b
Oscillator Type
Internal
Video File
NXP LPC553x/S3x MCU Family | Datasheet Preview
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
LPC553x/S3x MCU Family
PCN Design/Specification
Datasheet Update 23/Nov/2022LPC553x 04/May/2024
PCN Packaging
LPCx/PRH601HLx/PXAH30KFBEx 01/Jun/2022
LPC5534JBD100E Documents
Download datasheets and manufacturer documentation for LPC5534JBD100E
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