NXP USA Inc.
LPC3250FET296/01K
Microcontrollers
LPC3250FET296/01K
4-LPC3250FET296/01K
IC MCU 16/32BIT ROMLESS 296TFBGA
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LPC3250FET296/01K Description
Tech Specifications
Mfr
NXP USA Inc.
Series
LPC3200
Package
Tray
Core Processor
ARM9®
Program Memory Type
ROMless
RAM Size
256K x 8
Number of I/O
51
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
296-TFBGA
Supplier Device Package
296-TFBGA (15x15)
Base Product Number
LPC3250
Speed
266MHz
Core Size
16/32-Bit
Connectivity
EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, Motor Control PWM, PWM, WDT
Voltage - Supply (Vcc/Vdd)
0.9V ~ 3.6V
Data Converters
A/D 3x10b SAR
Oscillator Type
Internal
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
PCN Packaging
5+1 Dry Pack Chg 4/May/2022All Dev Label Update 15/Dec/2020
LPC3250FET296/01K Documents
Download datasheets and manufacturer documentation for LPC3250FET296/01K
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