NXP USA Inc.
LPC2210FBD144/01,5
Microcontrollers
LPC2210FBD144/01,5
4-LPC2210FBD144/01,5
IC MCU 16/32BIT ROMLESS 144LQFP
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LPC2210FBD144/01,5 Description
Tech Specifications
Mfr
NXP USA Inc.
Series
LPC2200
Package
Tray
Core Processor
ARM7®
Program Memory Type
ROMless
RAM Size
16K x 8
Number of I/O
76
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
144-LQFP
Supplier Device Package
144-LQFP (20x20)
Base Product Number
LPC2210
Speed
60MHz
Core Size
16/32-Bit
Connectivity
EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
POR, PWM, WDT
Voltage - Supply (Vcc/Vdd)
1.65V ~ 3.6V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Product Training Modules
Migrating from 8/16-Bit MCUs to 32-Bit ARMs
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Packaging
All Dev Label Update 15/Dec/2020Mult Dev Pkg Seal 15/Dec/2020
LPC2210FBD144/01,5 Documents
Download datasheets and manufacturer documentation for LPC2210FBD144/01,5
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NXP USA Inc.
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