NXP USA Inc._LPC2210FBD144/01,5
NXP USA Inc._LPC2210FBD144/01,5
NXP USA Inc.

LPC2210FBD144/01,5

Microcontrollers
NXP USA Inc.
LPC2210FBD144/01,5
4-LPC2210FBD144/01,5
IC MCU 16/32BIT ROMLESS 144LQFP
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LPC2210FBD144/01,5 Description

Tech Specifications

Mfr
NXP USA Inc.
Series
LPC2200
Package
Tray
Core Processor
ARM7®
Program Memory Type
ROMless
RAM Size
16K x 8
Number of I/O
76
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
144-LQFP
Supplier Device Package
144-LQFP (20x20)
Base Product Number
LPC2210
Speed
60MHz
Core Size
16/32-Bit
Connectivity
EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
POR, PWM, WDT
Voltage - Supply (Vcc/Vdd)
1.65V ~ 3.6V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Product Training Modules
Migrating from 8/16-Bit MCUs to 32-Bit ARMs
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Packaging
All Dev Label Update 15/Dec/2020Mult Dev Pkg Seal 15/Dec/2020

LPC2210FBD144/01,5 Documents

Download datasheets and manufacturer documentation for LPC2210FBD144/01,5

Shopping Guide

Payment Methods
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service