NXP USA Inc.
LPC18S50FET256551
Microcontrollers
LPC18S50FET256551
4-LPC18S50FET256551
IC MCU 32BIT ROMLESS 256LBGA
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LPC18S50FET256551 Description
Tech Specifications
Mfr
NXP USA Inc.
Series
LPC18xx
Package
Bulk
Core Processor
ARM® Cortex®-M3
Program Memory Type
ROMless
RAM Size
200K x 8
Number of I/O
164
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
256-LBGA
Supplier Device Package
256-LBGA (17x17)
Base Product Number
LPC18S50
Speed
180MHz
Core Size
32-Bit Single-Core
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd)
2.2V ~ 3.6V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
LPC18S50FET256551 Documents
Download datasheets and manufacturer documentation for LPC18S50FET256551
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