NXP USA Inc._LPC18S50FET256551
NXP USA Inc._LPC18S50FET256551
NXP USA Inc.

LPC18S50FET256551

Microcontrollers
NXP USA Inc.
LPC18S50FET256551
4-LPC18S50FET256551
IC MCU 32BIT ROMLESS 256LBGA
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LPC18S50FET256551 Description

Tech Specifications

Mfr
NXP USA Inc.
Series
LPC18xx
Package
Bulk
Core Processor
ARM® Cortex®-M3
Program Memory Type
ROMless
RAM Size
200K x 8
Number of I/O
164
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
256-LBGA
Supplier Device Package
256-LBGA (17x17)
Base Product Number
LPC18S50
Speed
180MHz
Core Size
32-Bit Single-Core
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd)
2.2V ~ 3.6V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal

LPC18S50FET256551 Documents

Download datasheets and manufacturer documentation for LPC18S50FET256551

Shopping Guide

Payment Methods
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service