NXP USA Inc.
LPC1830FET256
Microcontrollers
LPC1830FET256
4-LPC1830FET256
IC MCU 32BIT ROMLESS 256LBGA
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LPC1830FET256 Description
Tech Specifications
Mfr
NXP USA Inc.
Package
Tray
Core Processor
ARM® Cortex®-M3
Program Memory Type
ROMless
RAM Size
200K x 8
Number of I/O
164
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
256-LBGA
Supplier Device Package
256-LBGA (17x17)
Base Product Number
LPC1830
Speed
180MHz
Core Size
32-Bit
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd)
2.2V ~ 3.6V
Data Converters
A/D 8x10bSAR; D/A 1x10b
Oscillator Type
Internal
LPC1830FET256 Documents
Download datasheets and manufacturer documentation for LPC1830FET256
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