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NXP USA Inc._XPC850DEVR66BU
NXP USA Inc._XPC850DEVR66BU

NXP USA Inc.
XPC850DEVR66BU
Microprocessors

NXP USA Inc.
XPC850DEVR66BU
7-XPC850DEVR66BU
Ampheo
NXP USA Inc.-XPC850DEVR66BU-datasheets-133189.pdf
IC MPU MPC8XX 66MHZ 256BGA
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Description Tech Specifications Documents Related Parts Shopping Guide

Tech Specifications

Mfr
NXP USA Inc.
Series
MPC8xx
Package
Tray
Core Processor
MPC8xx
Operating Temperature
0°C ~ 95°C (TA)
Mounting Type
Surface Mount
Package / Case
256-BBGA
Supplier Device Package
256-PBGA (23x23)
Base Product Number
XPC85
Voltage - I/O
3.3V
Speed
66MHz
Number of Cores/Bus Width
1 Core, 32-Bit
Co-Processors/DSP
Communications; CPM
RAM Controllers
DRAM
Graphics Acceleration
No
Ethernet
10Mbps (1)
USB
USB 1.x (1)
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
PCN Packaging
All Dev Label Update 15/Dec/2020

XPC850DEVR66BU Documents

Download datasheets and manufacturer documentation for XPC850DEVR66BU

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Shopping Guide

Payment Methods
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service
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