Renesas Electronics America Inc
UPD70F3529GMA9-GBK-Q-G Microcontrollers
UPD70F3529GMA9-GBK-Q-G
4-UPD70F3529GMA9-GBK-Q-G
IC MCU 32BIT 2GB FLASH 176HLQFP
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Tech Specifications
Mfr
Renesas Electronics America Inc
Series
Automotive, AEC-Q100, V850E2/Dx4-H
Package
Tray
Core Processor
V850E2M
Program Memory Type
FLASH
RAM Size
96K x 8
Number of I/O
127
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
176-LQFP Exposed Pad
Supplier Device Package
176-HLQFP (24x24)
Base Product Number
UPD70F3529
Speed
80MHz
EEPROM Size
32K x 8
Core Size
32-Bit Single-Core
Connectivity
CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals
DMA, I²S, LCD, LVD, POR, PWM, WDT
Program Memory Size
2GB (2G x 8)
Voltage - Supply (Vcc/Vdd)
2.7V ~ 5.5V
Data Converters
A/D 12x10b, 12x12b
Oscillator Type
Internal
Featured Product
Ticket Vending Machine
PCN Packaging
Label Change-All Devices 01/Dec/2022
UPD70F3529GMA9-GBK-Q-G Documents
Download datasheets and manufacturer documentation for UPD70F3529GMA9-GBK-Q-G
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Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
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