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Trenz Electronic GmbH_TE0803-02-04CG-1EB
Trenz Electronic GmbH_TE0803-02-04CG-1EB

Trenz Electronic GmbH
TE0803-02-04CG-1EB
Microcontrollers, Microprocessor, FPGA Modules

Trenz Electronic GmbH
TE0803-02-04CG-1EB
8-TE0803-02-04CG-1EB
Ampheo
Trenz Electronic GmbH-TE0803-02-04CG-1EB-datasheets-168614.pdf
IC MODULE ZYNQ USCALE 2GB 256MB
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Description Tech Specifications Documents Related Parts Shopping Guide

Tech Specifications

Mfr
Trenz Electronic GmbH
Series
TE0803
Package
Bulk
Core Processor
Zynq UltraScale+ XCZU4CG-1SFVC784E
RAM Size
2GB
Operating Temperature
0°C ~ 85°C
Base Product Number
TE0803
Module/Board Type
MPU Core
Flash Size
256MB
Connector Type
B2B
Size / Dimension
2.050" L x 2.990" W (52.00mm x 76.00mm)
Design Resources
TE0803-02-04CG-1EB Assembly DiagramTE0803-02-04CG-1EB Schematic
CAD Models
TE0803-02.stp

TE0803-02-04CG-1EB Documents

Download datasheets and manufacturer documentation for TE0803-02-04CG-1EB

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Shopping Guide

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