NXP USA Inc.
S9S12GN32F1VLCR Microcontrollers
S9S12GN32F1VLCR
4-S9S12GN32F1VLCR
IC MCU 16BIT 32KB FLASH 32LQFP
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Tech Specifications
Mfr
NXP USA Inc.
Series
HCS12
Package
Tape & Reel (TR)Cut Tape (CT)®
Core Processor
12V1
Program Memory Type
FLASH
RAM Size
2K x 8
Number of I/O
26
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
32-LQFP
Supplier Device Package
32-LQFP (7x7)
Base Product Number
S9S12
Speed
25MHz
EEPROM Size
1K x 8
Core Size
16-Bit
Connectivity
IrDA, LINbus, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Program Memory Size
32KB (32K x 8)
Voltage - Supply (Vcc/Vdd)
3.13V ~ 5.5V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Design/Specification
MC9S12G DS Rev 10/May/2021Mult Dev 25/May/2020
PCN Assembly/Origin
Mult Dev Test Site 25/Mar/2021
PCN Packaging
All Dev Label Update 15/Dec/2020Mult Dev Pkg Seal 15/Dec/2020
S9S12GN32F1VLCR Documents
Download datasheets and manufacturer documentation for S9S12GN32F1VLCR
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