Epson Electronics America Inc-Semiconductor Div_S1C31W74B201000
Epson Electronics America Inc-Semiconductor Div_S1C31W74B201000
Epson Electronics America Inc-Semiconductor Div

S1C31W74B201000

Microcontrollers
S1C31W74B201000
4-S1C31W74B201000
IC MCU 32BIT 512KB FLSH 181VFBGA
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S1C31W74B201000 Description

Tech Specifications

Mfr
Epson Electronics America Inc-Semiconductor Div
Package
Tray
Core Processor
ARM® Cortex®-M0+
Program Memory Type
FLASH
RAM Size
128K x 8
Number of I/O
71
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
181-VFBGA
Supplier Device Package
181-VFBGA (8x8)
Base Product Number
S1C31W74
Speed
21MHz
Core Size
32-Bit Single-Core
Connectivity
I²C, IrDA, QSPI, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Program Memory Size
512KB (512K x 8)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Oscillator Type
External
Featured Product
Ticket Vending Machine

S1C31W74B201000 Documents

Download datasheets and manufacturer documentation for S1C31W74B201000

Shopping Guide

Payment Methods
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service