Epson Electronics America Inc-Semiconductor Div
S1C17W23F101100 Microcontrollers
S1C17W23F101100
4-S1C17W23F101100
IC MCU 16BIT 96KB FLASH 128TQFP
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Tech Specifications
Mfr
Epson Electronics America Inc-Semiconductor Div
Package
Tray
Core Processor
S1C17
Program Memory Type
FLASH
RAM Size
8K x 8
Number of I/O
41
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
128-TQFP
Supplier Device Package
128-TQFP (14x14)
Base Product Number
S1C17W23
Speed
4.2MHz
Core Size
16-Bit
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
LCD, PWM, RFC, WDT
Program Memory Size
96KB (96K x 8)
Voltage - Supply (Vcc/Vdd)
1.2V ~ 3.6V
Oscillator Type
Internal
Featured Product
Ticket Vending Machine
PCN Other
Quad Flat Package 17/Jul/2018
Errata
S1C17 Manual Errata
S1C17W23F101100 Documents
Download datasheets and manufacturer documentation for S1C17W23F101100
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