Epson Electronics America Inc-Semiconductor Div_S1C17W18F101100
Epson Electronics America Inc-Semiconductor Div_S1C17W18F101100

Epson Electronics America Inc-Semiconductor Div
S1C17W18F101100
Microcontrollers

S1C17W18F101100
4-S1C17W18F101100
IC MCU 16BIT 96KB FLASH 80TQFP
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Tech Specifications

Mfr
Epson Electronics America Inc-Semiconductor Div
Package
Tray
Core Processor
S1C17
Program Memory Type
FLASH
RAM Size
8K x 8
Number of I/O
67
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
80-TQFP
Supplier Device Package
80-TQFP14 (12x12)
Base Product Number
S1C17W18
Speed
4.2MHz
Core Size
16-Bit
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
LCD, PWM, RFC, WDT
Program Memory Size
96KB (96K x 8)
Voltage - Supply (Vcc/Vdd)
1.2V ~ 3.6V
Data Converters
A/D 9x12b
Oscillator Type
Internal
Featured Product
Ticket Vending Machine
Errata
S1C17 Manual Errata

S1C17W18F101100 Documents

Download datasheets and manufacturer documentation for S1C17W18F101100

Shopping Guide

Payment Methods
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service