Renesas Electronics America Inc
R7F7010323AFP#YR3 Microcontrollers
R7F7010323AFP#YR3
4-R7F7010323AFP#YR3
IC MCU 32BIT 768KB FLSH 176LFQFP
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Tech Specifications
Mfr
Renesas Electronics America Inc
Series
RH850/F1L
Package
Tray
Core Processor
RH850G3K
Program Memory Type
FLASH
RAM Size
96K x 8
Number of I/O
150
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
176-LQFP
Supplier Device Package
176-LFQFP (24x24)
Base Product Number
R7F7010323
Speed
80MHz
EEPROM Size
32K x 8
Core Size
32-Bit Single-Core
Connectivity
CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals
DMA, PWM, WDT
Program Memory Size
768KB (768K x 8)
Voltage - Supply (Vcc/Vdd)
3V ~ 5.5V
Data Converters
A/D 28x10b, 32x12b
Oscillator Type
Internal
Featured Product
Ticket Vending Machine
PCN Obsolescence/ EOL
EOL Mult Devices 15/Dec/2018
PCN Packaging
Label Change-All Devices 01/Dec/2022
Manuals
RH850 F1KH/KM Manual
R7F7010323AFP#YR3 Documents
Download datasheets and manufacturer documentation for R7F7010323AFP#YR3
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Delivery Methods
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