NXP USA Inc.
PXAH30KFBE,557 Microcontrollers
PXAH30KFBE,557
4-PXAH30KFBE,557
IC MCU 16BIT ROMLESS 100LQFP
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Tech Specifications
Mfr
NXP USA Inc.
Series
XA
Package
Tray
Core Processor
XA
Program Memory Type
ROMless
RAM Size
256 x 8
Number of I/O
33
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
100-LQFP
Supplier Device Package
100-LQFP (14x14)
Base Product Number
PXAH30
Speed
30MHz
Core Size
16-Bit
Connectivity
EBI/EMI, UART/USART
Peripherals
DMA, WDT
Voltage - Supply (Vcc/Vdd)
2.7V ~ 5.5V
Oscillator Type
External
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Obsolescence/ EOL
Multiple Devices 26/Dec/2012Multiple Devices Dec/2012
PCN Packaging
LPCx/PRH601HLx/PXAH30KFBEx 01/Jun/2022Mult Dev Pkg Seal 15/Dec/2020
PXAH30KFBE,557 Documents
Download datasheets and manufacturer documentation for PXAH30KFBE,557
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