Lattice Semiconductor Corporation_ORSPI4-3F1156C
Lattice Semiconductor Corporation_ORSPI4-3F1156C

Lattice Semiconductor Corporation
ORSPI4-3F1156C
System On Chip (SoC)

ORSPI4-3F1156C
6-ORSPI4-3F1156C
FPGA, 2024 CLBS, 471000 GATES
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ORSPI4-3F1156C Description

Tech Specifications

Mfr
Lattice Semiconductor Corporation
Series
ORCA® ORSPI4
Package
Bulk
Core Processor
SPI4
Number of I/O
356
Operating Temperature
-40°C ~ 125°C (TJ)
Package / Case
1156-BBGA
Supplier Device Package
1156-FPBGA (35x35)
Speed
250MHz
Connectivity
FIFO
Peripherals
LVD
Architecture
MPU, FPGA
Primary Attributes
FPGA - 15K Logic Elements

ORSPI4-3F1156C Documents

Download datasheets and manufacturer documentation for ORSPI4-3F1156C

Shopping Guide

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Shipping Rate
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Delivery Methods
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