NXP USA Inc.
MPC8313EVRADDC Microprocessors
MPC8313EVRADDC
7-MPC8313EVRADDC
IC MPU POWERQUICC II PRO 516PBGA
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Tech Specifications
Mfr
NXP USA Inc.
Series
*
Package
Tray
Mounting Type
Surface Mount
Package / Case
516-BBGA Exposed Pad
Supplier Device Package
516-TEPBGA (27x27)
Base Product Number
MPC8313
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
PCN Design/Specification
MPC8313 Copper Bond Wire 03/Jul/2014
PCN Packaging
All Dev Label Update 15/Dec/2020Mult Dev Pkg Seal 15/Dec/2020
MPC8313EVRADDC Documents
Download datasheets and manufacturer documentation for MPC8313EVRADDC
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Shipping Rate
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Delivery Methods
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