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NXP USA Inc._MPC755CVT350LE
NXP USA Inc._MPC755CVT350LE

NXP USA Inc.
MPC755CVT350LE
Microprocessors

NXP USA Inc.
MPC755CVT350LE
7-MPC755CVT350LE
Ampheo
NXP USA Inc.-MPC755CVT350LE-datasheets-133239.pdf
IC MPU MPC7XX 350MHZ 360FCPBGA
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Description Tech Specifications Documents Related Parts Shopping Guide

Tech Specifications

Mfr
NXP USA Inc.
Series
MPC7xx
Package
Tray
Core Processor
PowerPC
Operating Temperature
0°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
360-BBGA, FCBGA
Supplier Device Package
360-FCPBGA (25x25)
Base Product Number
MPC75
Voltage - I/O
2.5V, 3.3V
Speed
350MHz
Number of Cores/Bus Width
1 Core, 32-Bit
Graphics Acceleration
No
PCN Obsolescence/ EOL
Mult Device EOL 01/Apr/2016
PCN Design/Specification
Reference Manual Update 28/Mar/2014
PCN Packaging
Mult Dev Pkg Seal 15/Dec/2020Mult Devices Label 20/Dec/2017

MPC755CVT350LE Documents

Download datasheets and manufacturer documentation for MPC755CVT350LE

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Shopping Guide

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