NXP USA Inc.
MPC745BPX350LE Microprocessors
MPC745BPX350LE
7-MPC745BPX350LE
IC MPU MPC7XX 350MHZ 255FCPBGA
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Tech Specifications
Mfr
NXP USA Inc.
Series
MPC7xx
Package
Tray
Core Processor
PowerPC
Operating Temperature
0°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
255-BBGA, FCBGA
Supplier Device Package
255-FCPBGA (21x21)
Base Product Number
MPC74
Voltage - I/O
2.5V, 3.3V
Speed
350MHz
Number of Cores/Bus Width
1 Core, 32-Bit
Graphics Acceleration
No
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
PCN Obsolescence/ EOL
Mult Device EOL 01/Apr/2016
PCN Design/Specification
Reference Manual Update 28/Mar/2014
PCN Packaging
All Dev Label Update 15/Dec/2020Mult Dev Pkg Seal 15/Dec/2020
MPC745BPX350LE Documents
Download datasheets and manufacturer documentation for MPC745BPX350LE
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