Microchip Technology
MEC1609I-PZP Application Specific Microcontrollers
MEC1609I-PZP
1-MEC1609I-PZP
MIXED SIGNAL MOBILE EMBEDDED CON
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MEC1609I-PZP Description
Tech Specifications
Core Processor
ARC-625D
Operating Temperature
-40°C ~ 85°C
Program Memory Type
FLASH (192kB)
Applications
I/O Controller
RAM Size
16KB
ECCN
EAR99
Number of I/O
115
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
144-LFBGA (10x10)
Series
-
Package / Case
144-LFBGA
Voltage - Supply
3.3V
REACH Status
REACH Unaffected
Mfr
Microchip Technology
HTSUS
8542.31.0001
Package
Tray
Controller Series
-
Interface
ACPI, BC-Link, I2C/SMBus, LPC, PECI, PS/2, SPI, VLPC
RoHS Status
ROHS3 Compliant
Base Product Number
MEC1609
Moisture Sensitivity Level (MSL)
1 (Unlimited)
MEC1609I-PZP Documents
Download datasheets and manufacturer documentation for MEC1609I-PZP
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Shipping Rate
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Delivery Methods
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