NXP USA Inc._MCF5307CFT66B
NXP USA Inc._MCF5307CFT66B

NXP USA Inc.
MCF5307CFT66B
Microcontrollers

NXP USA Inc.
MCF5307CFT66B
4-MCF5307CFT66B
IC MCU 32BIT ROMLESS 208FQFP
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Tech Specifications

Mfr
NXP USA Inc.
Series
MCF530x
Package
Tray
Core Processor
Coldfire V3
Program Memory Type
ROMless
RAM Size
4K x 8
Number of I/O
16
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
208-BFQFP
Supplier Device Package
208-FQFP (28x28)
Base Product Number
MCF5307
Speed
66MHz
Core Size
32-Bit Single-Core
Connectivity
EBI/EMI, I²C, UART/USART
Peripherals
DMA, POR, WDT
Voltage - Supply (Vcc/Vdd)
3V ~ 3.6V
Oscillator Type
External
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Packaging
All Dev Label Update 15/Dec/2020

MCF5307CFT66B Documents

Download datasheets and manufacturer documentation for MCF5307CFT66B

Shopping Guide

Payment Methods
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service