NXP USA Inc.
MC9S12KG256MPVE Microcontrollers
MC9S12KG256MPVE
4-MC9S12KG256MPVE
IC MCU 16BIT 256KB FLASH 112LQFP
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Tech Specifications
Mfr
NXP USA Inc.
Series
HCS12
Package
Tray
Core Processor
HCS12
Program Memory Type
FLASH
RAM Size
12K x 8
Number of I/O
91
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
112-LQFP
Supplier Device Package
112-LQFP (20x20)
Base Product Number
MC9S12
Speed
25MHz
EEPROM Size
4K x 8
Core Size
16-Bit
Connectivity
CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Program Memory Size
256KB (256K x 8)
Voltage - Supply (Vcc/Vdd)
2.35V ~ 5.5V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Packaging
All Dev Label Update 15/Dec/2020
MC9S12KG256MPVE Documents
Download datasheets and manufacturer documentation for MC9S12KG256MPVE
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Delivery Methods
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