NXP USA Inc.
MC9S12DP512MPVE
Microcontrollers
MC9S12DP512MPVE
4-MC9S12DP512MPVE
IC MCU 16BIT 512KB FLASH 112LQFP
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MC9S12DP512MPVE Description
Tech Specifications
Clock Frequency
50MHz
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Program Memory Type
FLASH
Surface Mount
YES
EEPROM Size
4K x 8
Height Seated (Max)
1.6mm
Package / Case
112-LQFP
Address Bus Width
20
Terminal Form
GULL WING
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Operating Temperature
-40°C~125°C TA
HTS Code
8542.31.00.01
Bit Size
16
DAC Channels
NO
Mounting Type
Surface Mount
Oscillator Type
Internal
PWM Channels
YES
Core Size
16-Bit
Packaging
Tray
Connectivity
CANbus, I2C, SCI, SPI
Program Memory Size
512KB 512K x 8
Terminal Pitch
0.65mm
Terminal Finish
Matte Tin (Sn)
DMA Channels
NO
Terminal Position
QUAD
JESD-30 Code
S-PQFP-G112
Data Converter
A/D 16x10b
Number of Terminations
112
Supply Voltage-Max (Vsup)
2.75V
Supply Voltage
2.5V
Width
20mm
Qualification Status
Not Qualified
Voltage - Supply (Vcc/Vdd)
2.35V~5.25V
RoHS Status
ROHS3 Compliant
Speed
25MHz
Supply Voltage-Min (Vsup)
2.35V
RAM Size
12K x 8
Additional Feature
ALSO REQUIRES 5V SUPPLY
Number of I/O
91
Peripherals
PWM, WDT
External Data Bus Width
16
JESD-609 Code
e3
Factory Lead Time
10 Weeks
Time@Peak Reflow Temperature-Max (s)
40
Has ADC
YES
Peak Reflow Temperature (Cel)
260
Series
HCS12
Length
20mm
Part Status
Active
Published
2001
Base Part Number
MC9S12DP512
MC9S12DP512MPVE Documents
Download datasheets and manufacturer documentation for MC9S12DP512MPVE
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