NXP USA Inc.
MC9S08QG8MFFE
Microcontrollers
MC9S08QG8MFFE
4-MC9S08QG8MFFE
IC MCU 8BIT 8KB FLASH 16QFN
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MC9S08QG8MFFE Description
Tech Specifications
Mfr
NXP USA Inc.
Series
S08
Package
Tray
Core Processor
S08
Program Memory Type
FLASH
RAM Size
512 x 8
Number of I/O
12
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
16-VQFN Exposed Pad
Supplier Device Package
16-QFN-EP (5x5)
Base Product Number
MC9S08
Speed
20MHz
Core Size
8-Bit
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Program Memory Size
8KB (8K x 8)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Product Training Modules
USBSpyder08 Discovery Kit
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Design/Specification
QFN 3X3.4X4,5X5 Assembly Site 12/Nov/2015
PCN Assembly/Origin
Mult Dev Site Chgs 18/Dec/2020
PCN Packaging
All Dev Label Update 15/Dec/2020Mult Dev ShipBox Chg 14/Feb/2022
MC9S08QG8MFFE Documents
Download datasheets and manufacturer documentation for MC9S08QG8MFFE
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Shopping Guide
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Shipping Rate
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Delivery Methods
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