NXP USA Inc.
MC9S08QG4CFQE Microcontrollers
MC9S08QG4CFQE
4-MC9S08QG4CFQE
IC MCU 8BIT 4KB FLASH 8DFN
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Tech Specifications
Mfr
NXP USA Inc.
Series
S08
Package
Tray
Core Processor
S08
Program Memory Type
FLASH
RAM Size
256 x 8
Number of I/O
4
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
8-VDFN Exposed Pad
Supplier Device Package
8-DFN-EP (4x4)
Base Product Number
MC9S08
Speed
20MHz
Core Size
8-Bit
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Program Memory Size
4KB (4K x 8)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Product Training Modules
Introduction to MC9S08QG Series of MCUsUSBSpyder08 Discovery Kit
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Obsolescence/ EOL
Multiple Devices 03/Oct/2012
PCN Design/Specification
QFN 3X3.4X4,5X5 Assembly Site 12/Nov/2015
PCN Assembly/Origin
Mult Dev Site Chgs 18/Dec/2020
PCN Packaging
All Dev Label Update 15/Dec/2020Mult Dev Pkg Seal 15/Dec/2020
MC9S08QG4CFQE Documents
Download datasheets and manufacturer documentation for MC9S08QG4CFQE
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