NXP USA Inc.
MC9S08PA4VTG Microcontrollers
MC9S08PA4VTG
4-MC9S08PA4VTG
IC MCU 8BIT 4KB FLASH 16TSSOP
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Tech Specifications
Mfr
NXP USA Inc.
Series
S08
Package
Tube
Core Processor
S08
Program Memory Type
FLASH
RAM Size
512 x 8
Number of I/O
14
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package
16-TSSOP
Base Product Number
MC9S08
Speed
20MHz
EEPROM Size
128 x 8
Core Size
8-Bit
Connectivity
LINbus, SPI, UART/USART
Peripherals
LVD, POR, PWM, WDT
Program Memory Size
4KB (4K x 8)
Voltage - Supply (Vcc/Vdd)
2.7V ~ 5.5V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Design/Specification
Datasheet Chg 06/Jan/2016MC9S08Py Series Datasheet Rev 3/Aug/2020
PCN Assembly/Origin
Mult Dev Site Chgs 18/Dec/2020
PCN Packaging
All Dev Label Update 15/Dec/2020Mult Dev Pkg Seal 15/Dec/2020
Errata
MC9S08PA4 Mask Errata
MC9S08PA4VTG Documents
Download datasheets and manufacturer documentation for MC9S08PA4VTG
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Shipping Rate
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Delivery Methods
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