NXP USA Inc.
MC68HC16Z1CEH16
FPGAs (Field Programmable Gate Array)
MC68HC16Z1CEH16
2-MC68HC16Z1CEH16
ROMless CPU16 16-Bit Microcontroller HC16 Series MC68HC16 5V 132-BQFP Bumpered
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Tech Specifications
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Program Memory Type
ROMless
Surface Mount
YES
Height Seated (Max)
4.572mm
Package / Case
132-BQFP Bumpered
Address Bus Width
20
Terminal Form
GULL WING
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Operating Temperature
-40°C~85°C TA
HTS Code
8542.31.00.01
Bit Size
16
DAC Channels
NO
Mounting Type
Surface Mount
Oscillator Type
Internal
PWM Channels
YES
Core Size
16-Bit
Packaging
Tray
Connectivity
EBI/EMI, SCI, SPI
Terminal Pitch
0.635mm
Core Processor
CPU16
Terminal Finish
Matte Tin (Sn)
DMA Channels
NO
Terminal Position
QUAD
JESD-30 Code
S-PQFP-G132
Data Converter
A/D 8x10b
Number of Terminations
132
Supply Voltage-Max (Vsup)
5.5V
Supply Voltage
5V
ECCN Code
EAR99
Width
24.13mm
Qualification Status
Not Qualified
Voltage - Supply (Vcc/Vdd)
2.7V~5.5V
RoHS Status
ROHS3 Compliant
Speed
16MHz
Supply Voltage-Min (Vsup)
4.5V
RAM Size
1K x 8
Additional Feature
IT ASLO OPERATES AT 3V
Number of I/O
16
Peripherals
POR, PWM, WDT
External Data Bus Width
16
JESD-609 Code
e3
Factory Lead Time
11 Weeks
Time@Peak Reflow Temperature-Max (s)
30
Has ADC
YES
Peak Reflow Temperature (Cel)
245
Series
HC16
Length
24.13mm
Part Status
Not For New Designs
Published
1999
Base Part Number
MC68HC16
MC68HC16Z1CEH16 Documents
Download datasheets and manufacturer documentation for MC68HC16Z1CEH16
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