Infineon Technologies_MB89899PF-G-173-BNDE1
Infineon Technologies_MB89899PF-G-173-BNDE1

Infineon Technologies
MB89899PF-G-173-BNDE1
Microcontrollers

MB89899PF-G-173-BNDE1
4-MB89899PF-G-173-BNDE1
IC MICROCONTROLLER
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Tech Specifications

Mfr
Infineon Technologies
Series
F²MC-8L MB89890
Package
Tray
Core Processor
F²MC-8L
Program Memory Type
Mask ROM
RAM Size
2K x 8
Number of I/O
85
Operating Temperature
-20°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
100-BQFP
Supplier Device Package
100-QFP (14x20)
Base Product Number
MB89899
Speed
8MHz
Core Size
8-Bit
Connectivity
Serial I/O
Peripherals
POR, PWM, WDT
Program Memory Size
60KB (60K x 8)
Voltage - Supply (Vcc/Vdd)
2.2V ~ 6V
Data Converters
A/D 8x8b
Oscillator Type
External
Featured Product
Ticket Vending Machine
PCN Obsolescence/ EOL
Mult Device EOL 19/Mar/2017
PCN Packaging
Date Code/Shelf Life Chgs 18/Jul/2019Ship Label REV

MB89899PF-G-173-BNDE1 Documents

Download datasheets and manufacturer documentation for MB89899PF-G-173-BNDE1

Shopping Guide

Payment Methods
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service