NXP USA Inc.
LPC55S66JBD100K
Microcontrollers
LPC55S66JBD100K
4-LPC55S66JBD100K
IC MCU 32BIT 256KB FLSH 100HLQFP
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LPC55S66JBD100K Description
Tech Specifications
Mfr
NXP USA Inc.
Series
LPC55S6x
Package
Tray
Core Processor
ARM® Cortex®-M33
Program Memory Type
FLASH
RAM Size
144K x 8
Number of I/O
64
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
100-LQFP Exposed Pad
Supplier Device Package
100-HLQFP (14x14)
Base Product Number
LPC55S66
Speed
150MHz
Core Size
32-Bit Single-Core
Connectivity
Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Program Memory Size
256KB (256K x 8)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 10x16b
Oscillator Type
Internal
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
LPC5500Ticket Vending Machine
PCN Design/Specification
LPC55S6x/LPC55S2x/LPC552x 22/Dec/2022
PCN Assembly/Origin
LPC55(S)6x/LPC552x 29/Aug/2022LPC55x 17/Apr/2022
PCN Packaging
LPCx/PRH601HLx/PXAH30KFBEx 01/Jun/2022Mult Dev Pkg Seal 15/Dec/2020
LPC55S66JBD100K Documents
Download datasheets and manufacturer documentation for LPC55S66JBD100K
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Delivery Methods
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