NXP USA Inc._LPC5534JBD64MP
NXP USA Inc._LPC5534JBD64MP
NXP USA Inc.

LPC5534JBD64MP

Microcontrollers
NXP USA Inc.
LPC5534JBD64MP
4-LPC5534JBD64MP
ARM CORTEX-M33-BASED MICROCONTRO
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LPC5534JBD64MP Description

Tech Specifications

Mfr
NXP USA Inc.
Package
Tape & Reel (TR)
Core Processor
ARM® Cortex®-M33
Program Memory Type
FLASH
RAM Size
96K x 8
Number of I/O
39
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
64-TQFP Exposed Pad
Supplier Device Package
64-HTQFP (10x10)
Speed
150MHz
Core Size
32-Bit
Connectivity
CANbus, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Program Memory Size
128KB (128K x 8)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 13x16b SAR; D/A 3x12b
Oscillator Type
External, Internal
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
PCN Design/Specification
LPC553x 04/May/2024

LPC5534JBD64MP Documents

Download datasheets and manufacturer documentation for LPC5534JBD64MP

Shopping Guide

Payment Methods
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service