NXP USA Inc.
LPC5512JBD100E Microcontrollers
LPC5512JBD100E
4-LPC5512JBD100E
IC MCU 32BIT 64KB FLASH 100HLQFP
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Tech Specifications
Mfr
NXP USA Inc.
Series
LPC551x
Package
Tray
Core Processor
ARM® Cortex®-M33
Program Memory Type
FLASH
RAM Size
48K x 8
Number of I/O
64
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
100-LQFP Exposed Pad
Supplier Device Package
100-HLQFP (14x14)
Base Product Number
LPC5512
Speed
150MHz
Core Size
32-Bit Single-Core
Connectivity
CANbus, Flexcomm, I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Program Memory Size
64KB (64K x 8)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 10x16b SAR
Oscillator Type
Internal
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
Ticket Vending Machine
PCN Assembly/Origin
Wafer Fab 19/Mar/2023
PCN Packaging
LPCx/PRH601HLx/PXAH30KFBEx 01/Jun/2022Mult Dev Pkg Seal 15/Dec/2020
LPC5512JBD100E Documents
Download datasheets and manufacturer documentation for LPC5512JBD100E
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Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
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