NXP USA Inc.
LPC5506JBD64E Microcontrollers
LPC5506JBD64E
4-LPC5506JBD64E
IC MCU 32BIT 256KB FLASH 64HTQFP
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Tech Specifications
Mfr
NXP USA Inc.
Package
Tray
Core Processor
ARM® Cortex®-M33
Program Memory Type
FLASH
RAM Size
96K x 8
Number of I/O
45
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
64-TQFP Exposed Pad
Supplier Device Package
64-HTQFP (10x10)
Base Product Number
LPC5506
Speed
96MHz
Core Size
32-Bit Single-Core
Connectivity
CANbus, Flex COMM, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Program Memory Size
256KB (256K x 8)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 9x16b SAR
Oscillator Type
Internal
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
LPC550x/S0x MCUs
PCN Design/Specification
LPC55S0x/LPC550x 09/Feb/2023LPC55S0x/LPC550x 27/Apr/2023Multi Design 02/25/2022
PCN Assembly/Origin
Wafer Fab 19/Mar/2023
PCN Packaging
All Dev Label Update 15/Dec/2020LPC55- 05/Feb/2023
LPC5506JBD64E Documents
Download datasheets and manufacturer documentation for LPC5506JBD64E
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