NXP USA Inc.
LPC3143FET180,551 Microcontrollers
LPC3143FET180,551
4-LPC3143FET180,551
IC MCU 16/32BIT ROMLESS 180TFBGA
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Tech Specifications
Mfr
NXP USA Inc.
Series
LPC3100
Package
Tray
Core Processor
ARM926EJ-S
Program Memory Type
ROMless
RAM Size
192K x 8
Number of I/O
20
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
180-TFBGA
Supplier Device Package
180-TFBGA (12x12)
Base Product Number
LPC3143
Speed
270MHz
Core Size
16/32-Bit
Connectivity
EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, PWM, WDT
Voltage - Supply (Vcc/Vdd)
1.1V ~ 3.6V
Data Converters
A/D 4x10b
Oscillator Type
External
Video File
MCUXpresso Software & Tools Announcement from Geoff Lees
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
LPC MicrocontrollersTicket Vending Machine
PCN Obsolescence/ EOL
Mult Dev EOL Rev 13/Dec/2022OBS Notice 02/Dec/2022
PCN Packaging
All Dev Label Update 15/Dec/2020Package Changes 17/Jun/2021
LPC3143FET180,551 Documents
Download datasheets and manufacturer documentation for LPC3143FET180,551
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