NXP USA Inc.
LPC2926FBD144,557
Microcontrollers
LPC2926FBD144,557
4-LPC2926FBD144,557
IC MCU 16/32B 256KB FLSH 144LQFP
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LPC2926FBD144,557 Description
Tech Specifications
Mfr
NXP USA Inc.
Series
LPC2900
Package
Tray
Core Processor
ARM9®
Program Memory Type
FLASH
RAM Size
56K x 8
Number of I/O
104
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
144-LQFP
Supplier Device Package
144-LQFP (20x20)
Base Product Number
LPC2926
Speed
125MHz
EEPROM Size
16K x 8
Core Size
16/32-Bit
Connectivity
CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB
Peripherals
DMA, POR, PWM, WDT
Program Memory Size
256KB (256K x 8)
Voltage - Supply (Vcc/Vdd)
1.71V ~ 3.6V
Data Converters
A/D 24x10b
Oscillator Type
Internal
Video File
MCUXpresso Software & Tools Announcement from Geoff Lees
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
LPC MicrocontrollersTicket Vending Machine
PCN Obsolescence/ EOL
LPC29xx obs 15/May/2023
PCN Packaging
5+1 Dry Pack Chg 4/May/2022Mult Dev Pkg Seal 15/Dec/2020
LPC2926FBD144,557 Documents
Download datasheets and manufacturer documentation for LPC2926FBD144,557
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