NXP USA Inc.
LPC2364FBD100K
Microcontrollers
LPC2364FBD100K
4-LPC2364FBD100K
IC MCU 16/32B 128KB FLSH 100LQFP
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LPC2364FBD100K Description
Tech Specifications
Mfr
NXP USA Inc.
Series
LPC2300
Package
Tray
Core Processor
ARM7®
Program Memory Type
FLASH
RAM Size
34K x 8
Number of I/O
70
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
100-LQFP
Supplier Device Package
100-LQFP (14x14)
Base Product Number
LPC2364
Speed
72MHz
Core Size
16/32-Bit
Connectivity
CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Program Memory Size
128KB (128K x 8)
Voltage - Supply (Vcc/Vdd)
3V ~ 3.6V
Data Converters
A/D 6x10b SAR; D/A 1x10b
Oscillator Type
Internal
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
PCN Packaging
LPCx/PRH601HLx/PXAH30KFBEx 01/Jun/2022Mult Dev Pkg Seal 15/Dec/2020
LPC2364FBD100K Documents
Download datasheets and manufacturer documentation for LPC2364FBD100K
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Shopping Guide
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Delivery Methods
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