NXP USA Inc.
LPC2290FBD144015
Microcontrollers
LPC2290FBD144015
4-LPC2290FBD144015
IC MCU 16/32BIT ROMLESS 144LQFP
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LPC2290FBD144015 Description
Tech Specifications
Mfr
NXP USA Inc.
Series
LPC2200
Package
Bulk
Core Processor
ARM7®
Program Memory Type
ROMless
RAM Size
64K x 8
Number of I/O
76
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
144-LQFP
Supplier Device Package
144-LQFP (20x20)
Base Product Number
LPC2290
Speed
60MHz
Core Size
16/32-Bit
Connectivity
CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
PWM, WDT
Voltage - Supply (Vcc/Vdd)
1.65V ~ 3.6V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Featured Product
Ticket Vending Machine
LPC2290FBD144015 Documents
Download datasheets and manufacturer documentation for LPC2290FBD144015
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