NXP USA Inc.
LPC2109FBD64/01,15 Microcontrollers
LPC2109FBD64/01,15
4-LPC2109FBD64/01,15
IC MCU 16/32BIT 64KB FLSH 64LQFP
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Tech Specifications
Mfr
NXP USA Inc.
Series
LPC2100
Package
Tray
Core Processor
ARM7®
Program Memory Type
FLASH
RAM Size
8K x 8
Number of I/O
46
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
64-LQFP
Supplier Device Package
64-LQFP (10x10)
Base Product Number
LPC2109
Speed
60MHz
Core Size
16/32-Bit
Connectivity
CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
POR, PWM, WDT
Program Memory Size
64KB (64K x 8)
Voltage - Supply (Vcc/Vdd)
1.65V ~ 3.6V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Video File
MCUXpresso Software & Tools Announcement from Geoff Lees
Environmental Information
NXP USA Inc REACHNXP USA Inc RoHS Cert
Featured Product
LPC MicrocontrollersTicket Vending Machine
PCN Packaging
All Dev Label Update 15/Dec/2020
LPC2109FBD64/01,15 Documents
Download datasheets and manufacturer documentation for LPC2109FBD64/01,15
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