Texas Instruments_DRA755BMGABCRQ1
Texas Instruments_DRA755BMGABCRQ1

Texas Instruments
DRA755BMGABCRQ1
DSP (Digital Signal Processors)

Texas Instruments
DRA755BMGABCRQ1
5-DRA755BMGABCRQ1
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DRA755BMGABCRQ1 Description

Tech Specifications

Operating Temperature
-40°C ~ 125°C (TJ)
Non-Volatile Memory
ROM (256kB)
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
760-FCBGA (23x23)
Series
DRA74x
Clock Rate
-
Type
Floating Point
Package / Case
760-BFBGA, FCBGA
Mfr
Texas Instruments
Voltage - Core
1.15V
Voltage - I/O
1.35V, 1.8V, 3.3V
Package
Bulk
Interface
CANbus, I2C, McASP, SPI, UART
RoHS Status
ROHS3 Compliant
On-Chip RAM
2.5MB
Moisture Sensitivity Level (MSL)
3 (168 Hours)

DRA755BMGABCRQ1 Documents

Download datasheets and manufacturer documentation for DRA755BMGABCRQ1

Shopping Guide

Payment Methods
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service