Advanced Micro Devices
AGXD533EEXF0BC
Microprocessors
AGXD533EEXF0BC
7-AGXD533EEXF0BC
IC MPU 400MHZ 396TEPBGA
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AGXD533EEXF0BC Description
Tech Specifications
Mfr
Advanced Micro Devices
Package
Bulk
Core Processor
AMD Geode™ GX
Operating Temperature
0°C ~ 85°C (TC)
Mounting Type
Surface Mount
Package / Case
396-BBGA
Supplier Device Package
396-TEPBGA (35x35)
Voltage - I/O
3.3V
Speed
400MHz
Number of Cores/Bus Width
1 Core
RAM Controllers
DDR
Graphics Acceleration
Yes
Display & Interface Controllers
TFT, VGA
AGXD533EEXF0BC Documents
Download datasheets and manufacturer documentation for AGXD533EEXF0BC
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