Microsemi Corporation
A2F060M3E-1FGG256 System On Chip (SoC)
A2F060M3E-1FGG256
6-A2F060M3E-1FGG256
IC SOC CORTEX-M3 100MHZ 256FBGA
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A2F060M3E-1FGG256 Description
Tech Specifications
Mfr
Microsemi Corporation
Series
SmartFusion®
Package
Tray
Core Processor
ARM® Cortex®-M3
RAM Size
16KB
Number of I/O
MCU - 26, FPGA - 66
Operating Temperature
0°C ~ 85°C (TJ)
Package / Case
256-LBGA
Supplier Device Package
256-FPBGA (17x17)
Base Product Number
A2F060M3E
Speed
100MHz
Connectivity
EBI/EMI, I²C, SPI, UART/USART
Peripherals
DMA, POR, WDT
Flash Size
128KB
Architecture
MCU, FPGA
Primary Attributes
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Environmental Information
Microchip CA Prop65Microchip REACHMicrochip RoHS
PCN Obsolescence/ EOL
EOL Notice 04/Apr/2017Mult Devices 04/Apr/2017
PCN Design/Specification
Mult Dev Design Advisory 13/Oct/2017Mult Dev Software Chg 8/Oct/2018
PCN Assembly/Origin
Mult Dev Test Site 28/Feb/2019
PCN Other
Logistics 24/Oct/2016
A2F060M3E-1FGG256 Documents
Download datasheets and manufacturer documentation for A2F060M3E-1FGG256
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Shopping Guide
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Shipping Rate
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Delivery Methods
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